Ostaa ACCESSORIES-PLASTIC COVER 2.3 BYCHPS: llä
Osta takuun mukaan
ACCESSORIES-PLASTIC COVER 2.3
- Osa numero:
- ACCESSORIES-PLASTIC COVER 2.3
- Valmistaja:
- Schaffner EMC, Inc.
- Kuvaus:
- COVER TERM PLAS FN3359 320/400A
- Lyijytön tila / RoHS-tila:
- Lyijytön / RoHS -yhteensopiva
- Saatavana oleva määrä:
- 13187 Pieces
- Tietolomake:
- ACCESSORIES-PLASTIC COVER 2.3.pdf
esittely
BYCHIPS on tukkumyyjä ACCESSORIES-PLASTIC COVER 2.3, meillä on varastot välittömään toimitukseen ja myös pitkäaikaiseen toimitukseen. Lähetä meille hankintasuunnitelma ACCESSORIES-PLASTIC COVER 2.3 sähköpostilla, annamme sinulle parhaan hinnan suunnitelmasi mukaan.
tekniset tiedot
| Sarja: | - |
|---|---|
| Muut nimet: | 1151-052 801919 817-1770 ACCESSORIES-PLASTIC COVER 2.3-ND ACCESSORIES-PLASTICCOVER2.3 ACCESSORIES-PLASTICCOVER2.3-ND ACCESSORIESPLASTICCOVER23 |
| Kosteuden herkkyys (MSL): | 1 (Unlimited) |
| Valmistajan toimitusaika: | 10 Weeks |
| Valmistajan osanumero: | ACCESSORIES-PLASTIC COVER 2.3 |
| For Use With / Oheistuotteet: | FN3359 Series |
| Kuvaus: | COVER TERM PLAS FN3359 320/400A |
| lisävaruste tyyppi: | Cover |
| Email: | [email protected] |
Aiheeseen liittyvät osat ACCESSORIES-PLASTIC COVER 2.3
| Kuva | Osa numero | valmistajat | Kuvaus | näkymä |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | tiedustelu |
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | tiedustelu |
 |
ACCESSORIES-PLASTIC COVER 2.2 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 250A | tiedustelu |
 |
ACCESSORIES-PLASTIC COVER 2.4 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 600A | tiedustelu |
 |
ACCESSORIES-PLASTIC COVER 1.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 800/1000A | tiedustelu |
 |
ACCESSORIES-PLASTIC COVER 2.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 150/180A | tiedustelu |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers