Ostaa 1393762-7 BYCHPS: llä
Osta takuun mukaan
1393762-7
- Osa numero:
- 1393762-7
- Valmistaja:
- Potter & Brumfield Relays / TE Connectivity
- Kuvaus:
- RELAY GEN PURPOSE
- Lyijytön tila / RoHS-tila:
- Sisältää lyijy / RoHS-yhteensopiva
- Saatavana oleva määrä:
- 16286 Pieces
- Tietolomake:
- 1393762-7.pdf
esittely
BYCHIPS on tukkumyyjä 1393762-7, meillä on varastot välittömään toimitukseen ja myös pitkäaikaiseen toimitukseen. Lähetä meille hankintasuunnitelma 1393762-7 sähköpostilla, annamme sinulle parhaan hinnan suunnitelmasi mukaan.
tekniset tiedot
| Sarja: | * |
|---|---|
| Muut nimet: | V23006G1020A 34 V23006G1020A34 |
| Kosteuden herkkyys (MSL): | 1 (Unlimited) |
| Valmistajan toimitusaika: | 18 Weeks |
| Valmistajan osanumero: | 1393762-7 |
| Laajennettu kuvaus: | Relay |
| Kuvaus: | RELAY GEN PURPOSE |
| Email: | [email protected] |
Aiheeseen liittyvät osat 1393762-7
| Kuva | Osa numero | valmistajat | Kuvaus | näkymä |
|---|---|---|---|---|
 |
1393762-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393761-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393760-1 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | tiedustelu |
|
1393762-5 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393762-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393761-9 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393761-1 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393761-8 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | tiedustelu |
|
1393759-2 | TE Connectivity Potter & Brumfield Relays | RELAY | tiedustelu |
|
1393760-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | tiedustelu |
|
1393759-1 | TE Connectivity Potter & Brumfield Relays | RELAY | tiedustelu |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers