Ostaa G8P-1A4P DC12 BYCHPS: llä
Osta takuun mukaan
G8P-1A4P DC12
- Osa numero:
- G8P-1A4P DC12
- Valmistaja:
- Omron
- Kuvaus:
- RELAY GEN PURPOSE SPST 30A 12V
- Lyijytön tila / RoHS-tila:
- Lyijytön / RoHS -yhteensopiva
- Saatavana oleva määrä:
- 15992 Pieces
- Tietolomake:
- G8P-1A4P DC12.pdf
esittely
BYCHIPS on tukkumyyjä G8P-1A4P DC12, meillä on varastot välittömään toimitukseen ja myös pitkäaikaiseen toimitukseen. Lähetä meille hankintasuunnitelma G8P-1A4P DC12 sähköpostilla, annamme sinulle parhaan hinnan suunnitelmasi mukaan.
tekniset tiedot
| Turn On Jännite (max): | 9 VDC |
|---|---|
| Sammuta Voltage (Min): | 1.2 VDC |
| päättyminen Style: | PC Pin |
| kytkentäjännite: | 250VAC, 28VDC - Max |
| Sarja: | G8P |
| Release Time: | 10ms |
| Relay Type: | General Purpose |
| Pakkaus: | Bulk |
| Muut nimet: | G8P-1A4-DC12 G8P-1A4P DC12 BYOMZ G8P-1A4P-DC12 G8P-1A4P-DC12-BYOMZ G8P1A4P12DC G8P1A4PDC12 G8P1A4PDC12BYOMI G8P1A4PDC12BYOMZ G8PT5191C G8PT6007F Z1007 |
| Käyttölämpötila: | -55°C ~ 105°C |
| Toiminta-aika: | 15ms |
| Asennustyyppi: | Through Hole |
| Kosteuden herkkyys (MSL): | 1 (Unlimited) |
| Valmistajan osanumero: | G8P-1A4P DC12 |
| ominaisuudet: | Insulation - Class F, Sealed - Fully |
| Laajennettu kuvaus: | General Purpose Relay SPST-NO (1 Form A) 12VDC Coil Through Hole |
| Kuvaus: | RELAY GEN PURPOSE SPST 30A 12V |
| Ota Arvostelu (Current): | 30A |
| Yhteydenotto Material: | Silver Cadmium Oxide (AgCdO) |
| Yhteydenottolomake: | SPST-NO (1 Form A) |
| Coil Voltage: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 155 Ohms |
| Coil Virta: | 900 mW |
| Coil Current: | 77mA |
| Email: | [email protected] |
Aiheeseen liittyvät osat G8P-1A4P DC12
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers