Ostaa RT114009 BYCHPS: llä
Osta takuun mukaan
RT114009
- Osa numero:
- RT114009
- Valmistaja:
- Potter & Brumfield Relays / TE Connectivity
- Kuvaus:
- RELAY GEN PURP
- Lyijytön tila / RoHS-tila:
- Lyijytön / RoHS -yhteensopiva
- Saatavana oleva määrä:
- 14229 Pieces
- Tietolomake:
- RT114009.pdf
esittely
BYCHIPS on tukkumyyjä RT114009, meillä on varastot välittömään toimitukseen ja myös pitkäaikaiseen toimitukseen. Lähetä meille hankintasuunnitelma RT114009 sähköpostilla, annamme sinulle parhaan hinnan suunnitelmasi mukaan.
tekniset tiedot
| Sarja: | * |
|---|---|
| Muut nimet: | 1393239-9 |
| Kosteuden herkkyys (MSL): | 1 (Unlimited) |
| Valmistajan toimitusaika: | 15 Weeks |
| Valmistajan osanumero: | RT114009 |
| Laajennettu kuvaus: | Relay Coil |
| Kuvaus: | RELAY GEN PURP |
| Email: | [email protected] |
Aiheeseen liittyvät osat RT114009
| Kuva | Osa numero | valmistajat | Kuvaus | näkymä |
|---|---|---|---|---|
 |
RT114006 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 6V | tiedustelu |
 |
RT114060 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 60V | tiedustelu |
 |
RT114012F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 12V | tiedustelu |
|
RT114024F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 24V | tiedustelu |
|
RT114018 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | tiedustelu |
 |
RT114012 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 12V | tiedustelu |
|
RT114048 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 48V | tiedustelu |
 |
RT114024 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 24V | tiedustelu |
 |
RT114005 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 5V | tiedustelu |
 |
RT114615 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 115V | tiedustelu |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers